Your Reliable Partner in Beryllium Oxide, Advanced Ceramics, and Precision Metallization
At Coraynic Technology Limited, we provide application-oriented solutions based on advanced ceramics, metallized ceramic components, ceramic-to-metal assemblies, and refractory metals.
Our expertise is focused on materials and components where thermal performance, electrical insulation, high-temperature stability, hermetic sealing, material purity, dimensional precision, and long-term reliability are critical. Rather than offering a broad range of commodity materials, we focus on technically demanding products that can be customized to meet specific application and engineering requirements.
Our core solutions combine Beryllium Oxide (BeO) ceramics, Alumina (Al₂O₃) ceramics, ceramic metallization and ceramic-to-metal sealing, together with selected refractory metal products including Tungsten, Molybdenum, Tantalum, and Niobium.
From material selection and component design to precision machining, metallization, brazing, inspection, and customized production, we work closely with customers to develop and supply components matched to their operating environment and technical specifications.
Thermal Management Solutions — High-thermal-conductivity BeO ceramic components for RF, microwave, and high-power electronic applications.
Electrical Insulation Solutions — Precision BeO and Alumina ceramic components for demanding electrical and high-voltage environments.
Metallization & Hermetic Sealing — Metallized BeO and Alumina ceramics for brazing, soldering, electrical connection, feedthroughs, and hermetic ceramic-to-metal assemblies.
High-Temperature & Vacuum Solutions — Tungsten and molybdenum crucibles, heaters, heat shields, and other refractory metal components for high-temperature and vacuum environments.
Semiconductor & Thin-Film Solutions — High-purity tungsten, molybdenum, tantalum, and niobium products, including sputtering targets, rings, and customized components.
Custom Engineered Components — Precision ceramic and refractory metal parts manufactured according to customer drawings, specifications, samples, and application requirements.
Our goal is not simply to supply materials, but to provide reliable material and component solutions that fit the customer’s application. By combining advanced ceramics with selected refractory metals and related processing technologies, Coraynic supports OEMs, engineers, and industrial customers seeking specialized materials, precision components, and customized solutions for demanding applications.
Effective thermal management is critical in high-power electronic and RF systems where excessive heat can reduce performance, reliability, and service life. Beryllium Oxide (BeO) ceramics combine high thermal conductivity with excellent electrical insulation, making them suitable for applications where heat dissipation and electrical isolation are required simultaneously.
Coraynic supplies BeO ceramic substrates, heat-spreading components, insulating parts, and customized ceramic components for RF and microwave electronics, high-power semiconductor devices, microwave vacuum tubes, and other thermal management applications.
We support customers with material selection, dimensional customization, precision machining, and application-specific ceramic solutions.
Key Solutions: BeO Ceramic · Thermal Management · RF & Microwave · Power Electronics · Custom Ceramic Components
Electrical insulation components must maintain stable insulating performance under demanding electrical, thermal, and environmental conditions. BeO and Alumina (Al₂O₃) ceramics provide excellent electrical insulation, dimensional stability, and resistance to high temperatures.
We provide precision ceramic insulators, substrates, tubes, sleeves, rings, and customized components for electronic, high-voltage, vacuum, and industrial applications.
Depending on operating conditions and performance requirements, customers can select suitable ceramic grades and geometries. Our manufacturing capabilities support precision machining, complex structures, small holes, and customized dimensions.
Key Solutions: BeO Insulators · Alumina Insulators · High-Voltage Insulation · Vacuum Insulation · Precision Ceramic Components
When ceramic components need to be electrically connected, brazed, or joined with metal structures, reliable metallization and ceramic-to-metal sealing are essential.
Coraynic provides metallized BeO and Alumina ceramics with customized metallization patterns for different electrical, mechanical, and brazing requirements. Metallization can be applied to flat surfaces, cylindrical surfaces, inner holes, stepped structures, and other complex geometries.
Our solutions support hermetic feedthroughs, RF components, vacuum assemblies, electronic packages, power modules, and ceramic-to-metal brazed assemblies.
We work with customers to match ceramic materials, metallization systems, metal components, and brazing requirements to the intended application.
Key Solutions: Metallized BeO · Metallized Alumina · Ceramic-to-Metal Sealing · Hermetic Feedthroughs · Brazed Ceramic Assemblies
High-temperature vacuum furnaces and crystal growth systems require materials that can maintain structural integrity and dimensional stability under extreme operating conditions.
Coraynic supplies selected tungsten and molybdenum components for high-temperature and vacuum applications. Products include sapphire crystal growth crucibles, heaters, heating elements, heat shields, insulation components, and customized furnace structural parts.
Tungsten and molybdenum offer excellent high-temperature performance, low vapor pressure, and good resistance to thermal deformation, making them suitable for demanding furnace environments.
Our products can be customized according to furnace configuration, drawings, dimensions, material purity, and operating requirements.
Key Solutions: Tungsten Crucibles · Molybdenum Crucibles · Heaters · Heat Shields · Vacuum Furnace Components · Sapphire Crystal Growth
Semiconductor and thin-film manufacturing processes require materials with high purity, stable physical properties, and reliable performance under demanding processing conditions.
Coraynic provides high-purity Tungsten (W), Molybdenum (Mo), Tantalum (Ta), and Niobium (Nb) products for sputtering, vacuum processing, and other specialized applications.
Our product range includes sputtering targets, target rings, plates, sheets, rods, and customized refractory metal components, with material purity, dimensions, geometry, and surface requirements tailored to customer specifications.
We work with OEMs, equipment manufacturers, and industrial customers to support material selection, specification matching, and customized component sourcing.
Key Solutions: Tungsten Targets · Molybdenum Targets · Tantalum Targets · Niobium Targets · Target Rings · Custom Refractory Metal Components
Many specialized applications require components that cannot be met by standard catalog products. Differences in equipment design, installation conditions, operating temperature, electrical requirements, and assembly methods often require customized materials and geometries.
Coraynic supports OEM and custom manufacturing of advanced ceramic and refractory metal components based on customer drawings, technical specifications, samples, or application requirements.
Our capabilities cover precision ceramic machining, metallization, ceramic-to-metal brazing, and customized tungsten, molybdenum, tantalum, and niobium components.
We can support projects from material selection and prototype development through production and quality inspection, helping customers develop practical and reliable components for specialized applications.
Key Solutions: Custom Ceramics · Metallized Ceramics · Ceramic-to-Metal Assemblies · Custom Refractory Metals · OEM Components · Precision Machining
Customer: Confidential Defense Electronics Manufacturer
Application: High-power microwave transmission window (C-band radar, satellite communication)
Material: 99.5% BeO Ceramic
Metallization: MoMn + Nickel
Component Types: Disc, Ball, Ring
The customer required a hermetic, low-loss microwave window capable of withstanding high thermal flux and thermal shock in C-band operation. The ceramic needed to provide:
Coraynic Technology engineered a custom BeO ceramic metallization solution:
BeO ceramic disck-ball-ring metalization MoMn+Nickel plating.
Successfully deployed in C-band radar systems and satellite communication ground terminals. Now in high-volume production.
Customer: An innovative manufacturer of solid-state and fiber lasers
Application: high power Laser
Material: 99.5% BeO Ceramic Substrate
Metallization: MoMn + Nickel + Flash Gold Plating
Substrate Size: 50.8 × 50.8 × 0.635 mm (2″×2″ standard), also custom 4″×4″
At Coraynic Technology Limited, our solutions are built around a focused range of advanced ceramic materials, metallization technologies, ceramic-to-metal joining, and refractory metals.
We combine material expertise with precision manufacturing and application-oriented engineering to support customers requiring thermal performance, electrical insulation, hermetic sealing, high-temperature stability, high material purity, and tight dimensional control.
Our capabilities cover Beryllium Oxide (BeO), Alumina (Al₂O₃), metallized ceramics, ceramic-to-metal assemblies, Tungsten, Molybdenum, Tantalum, and Niobium, with customized materials, geometries, and processing available according to application requirements.
BeO combines high thermal conductivity, excellent electrical insulation, low dielectric loss, and good dimensional stability, making it particularly suitable for high-power electronic and RF applications.
Grade | Purity | Thermal Conductivity | Dielectric Constant | Typical Applications |
B-99 | ≥99% | ≥260 W/m·K | 6.6 ±0.2 @ 1 MHz | General-purpose substrates, heat sinks |
B-99.5 | ≥99.5% | ≥285 W/m·K | 6.6 ±0.2 @ 1 MHz | High-power RF, microwave, aerospace |
Available Forms: Substrates, rods, tubes, crucibles, cylinders, discs, rings, windows, and customized ceramic components.
Alumina provides a strong combination of electrical insulation, mechanical strength, chemical stability, and high-temperature performance. Different purity grades can be selected according to electrical, mechanical, and environmental requirements.
Grade | Purity | Density | Flexural Strength | Typical Applications |
A-95 | 95% | ≥3.65 g/cm³ | ≥280 MPa | Vacuum feedthroughs, connectors |
A-97 | 97% | ≥3.70 g/cm³ | ≥300 MPa | High-insulation components |
A-99 | 99% | ≥3.85 g/cm³ | ≥455 MPa | Semiconductor equipment, aerospace |
A-99.8 | 99.8% | ≥3.90 g/cm³ | ≥500 MPa | Precision and high-purity applications |
Available Forms: Substrates, tubes, rings, insulators, sleeves, precision-machined components, and custom geometries.
We provide metallization solutions for BeO and Alumina ceramics, enabling ceramic components to be connected, brazed, soldered, or integrated into metal assemblies.
Technology | Typical Thickness | Typical Plating / Finish | Key Characteristics |
Mo-Mn Metallization | 15–38 μm | Ni / Au | Strong ceramic adhesion, brazable and solderable |
W Metallization | 10–25 μm | Ni / Au | High-temperature stability |
Active Brazing | 20–50 μm | — | Direct joining without conventional metallization |
Thin Film | 0.1–5 μm | Au | Fine-line circuits, wire bonding |
Thick Film | 10–20 μm | — | Power hybrid circuits and electronic assemblies |
Metallization Patterns
Our ceramic-to-metal joining capabilities support the production of hermetic feedthroughs, electronic packages, vacuum components, RF assemblies, and other ceramic-metal assemblies.
Metal Partner | Typical Joining System | Typical Applications |
Kovar (Fe-Ni-Co) | Ag-Cu / Au-based fillers | Hermetic packages, feedthroughs |
Oxygen-Free Copper | Ag-Cu / Au-Sn | High thermal conductivity assemblies |
Titanium & Alloys | Active brazing | Lightweight and corrosion-resistant assemblies |
Stainless Steel | Ag-Cu / Au-based fillers | High-strength and high-temperature assemblies |
Joining parameters can be optimized according to ceramic material, metal CTE, joint geometry, operating temperature, and hermeticity requirements.
In addition to advanced ceramics, Coraynic provides selected high-performance refractory metal materials and precision components, with a focus on Tungsten (W), Molybdenum (Mo), Tantalum (Ta), and Niobium (Nb).
These materials are selected for applications requiring high-temperature resistance, high purity, low vapor pressure, dimensional stability, corrosion resistance, and reliable performance in vacuum or demanding processing environments.
Core Refractory Metals
Material | Typical Purity | Key Properties | Typical Products / Applications |
Tungsten (W) | ≥99.95% / up to 99.99%+ | Extremely high melting point, high density, excellent high-temperature stability | Sapphire crucibles, heaters, heat shields, furnace parts, sputtering targets |
Molybdenum (Mo) | ≥99.95% / ≥99.97% | High-temperature strength, low thermal expansion, good thermal conductivity | Sputtering targets, heaters, heat shields, furnace components |
Tantalum (Ta) | ≥99.95% / higher purity available | Excellent corrosion resistance, high melting point, chemical stability | Semiconductor targets, target rings, plates, custom components |
Niobium (Nb) | ≥99.9% | High-temperature capability, ductility, corrosion resistance, superconducting properties | Targets, rings, rods, plates, vacuum and research components |
Selected refractory metal alloys can provide enhanced properties for specific applications.
Tungsten-Titanium (WTi)
Used for diffusion-barrier and adhesion-layer applications in semiconductor and microelectronic processes.
Molybdenum-Niobium (Mo-Nb)
Offers enhanced thermal and processing characteristics and is used in selected thin-film and display applications.
Other material compositions and customized grades can be considered according to application requirements and manufacturing feasibility.
Refractory Metal Products
Our refractory metal product range includes:
Products can be manufactured according to customer drawings, material specifications, purity requirements, dimensions, surface conditions, and application requirements.
