BeO Ceramic – High Thermal Conductivity Beryllium Oxide Ceramic Components

BeO Ceramic – High Thermal Conductivity Beryllium Oxide Ceramic Components

High-Purity BeO Ceramic for Thermal Management and Electrical Insulation

Product Description

Coraynic Technology Limited supplies Beryllium Oxide (BeO) Ceramic components designed for applications requiring a combination of high thermal conductivity, electrical insulation, dimensional stability, and reliable high-temperature performance.

BeO ceramic is particularly suitable for applications where conventional electrically insulating ceramics cannot provide sufficient thermal performance. Its high thermal conductivity enables efficient heat dissipation while maintaining electrical isolation, making it suitable for high-power electronic and high-frequency systems.

Our BeO ceramics are manufactured from high-purity beryllium oxide powder using controlled forming and sintering processes. Precision grinding and machining are available for applications requiring controlled dimensions, surface finish, holes, grooves, steps, and other custom geometries.

Standard and custom BeO components can be supplied according to customer drawings, specifications, or application requirements.

Key Advantages of BeO Ceramic

High Thermal Conductivity

BeO provides high thermal conductivity while maintaining excellent electrical insulation. This combination makes it suitable for thermal management in high-power and high-frequency electronic systems.

Electrical Insulation

BeO offers high volume resistivity and dielectric strength, allowing it to function as both a thermal management material and an electrical insulating component.

High-Purity Material

High-purity BeO grades are available for applications where thermal performance, dielectric characteristics, and material consistency are critical.

Good High-Temperature Stability

BeO ceramic maintains its structural and electrical properties under elevated-temperature operating conditions and is suitable for demanding thermal environments.

Precision Ceramic Components

In addition to standard substrates, Coraynic can manufacture BeO components with customized dimensions, holes, grooves, steps, radii, and other precision features.


BeO Ceramic Material Specifications

The following values represent typical specifications for the BeO ceramic grade offered. Actual properties may vary depending on material grade, processing conditions, component geometry, and customer requirements.

PropertyTypical Specification
MaterialBeryllium Oxide (BeO)
Purity≥99.5%
AppearanceWhite ceramic
Density2.88 g/cm³
Melting PointApprox. 2530°C
Thermal ConductivityUp to 325 W/(m·K)
Dielectric Constant6.6 ± 0.2 @ 1 MHz
Dielectric Loss (tan δ)0.0012 @ 1 MHz
Volume Resistivity≥10¹⁴ Ω·cm @ 100°C
Breakdown Strength≥30 kV/mm
Flexural StrengthApprox. 200 MPa
Young’s ModulusApprox. 350 GPa
Poisson’s RatioApprox. 0.26
Specific HeatApprox. 1050 J/(kg·K)
Linear Expansion Coefficient7.0–8.0 × 10⁻⁶/K, 25–500°C
Air Permeability≤5 × 10⁻¹² Pa·m³/s

Specifications should be confirmed according to the selected BeO grade, component design, and application requirements.


BeO Ceramic Grades

Coraynic can supply different BeO ceramic grades according to thermal, electrical, mechanical, and processing requirements.

99% BeO Ceramic

A general-purpose BeO ceramic grade for applications requiring high thermal conductivity and electrical insulation.

Typical applications include:

  • Heat sinks
  • Ceramic insulating components
  • Electronic substrates
  • RF components
  • Thermal management parts

99.5% BeO Ceramic

A higher-purity grade for applications requiring improved material consistency and high thermal performance.

Typical applications include:

  • High-power semiconductor packaging
  • RF and microwave devices
  • High-frequency electronic components
  • High-reliability electronic assemblies
  • Metallized ceramic substrates

High-Thermal-Conductivity BeO

Selected BeO grades can provide thermal conductivity up to approximately 325 W/(m·K), depending on material formulation and processing.

For applications with specific thermal conductivity, dielectric, dimensional, or mechanical requirements, material selection can be discussed with our engineering team.


Standard BeO Ceramic Substrates

Standard substrate dimensions are available for selected applications, while custom sizes can be manufactured according to drawings.

ThicknessStandard Size
0.38 mm50.8 × 50.8 mm / 2″ × 2″
0.38 mm76.2 × 76.2 mm / 3″ × 3″
0.50 mm50.8 × 50.8 mm / 2″ × 2″
0.50 mm76.2 × 76.2 mm / 3″ × 3″
0.635 mm50.8 × 50.8 mm / 2″ × 2″
0.635 mm76.2 × 76.2 mm / 3″ × 3″
1.00 mm50.8 × 50.8 mm / 2″ × 2″
1.00 mm76.2 × 76.2 mm / 3″ × 3″
1.50 mm50.8 × 50.8 mm / 2″ × 2″
1.50 mm76.2 × 76.2 mm / 3″ × 3″

Custom substrate dimensions are also available, including rectangular and circular configurations.


Custom BeO Ceramic Components

Beyond flat substrates, Coraynic manufactures various BeO ceramic geometries according to customer drawings and specifications.

Available configurations may include:

  • Ceramic substrates
  • Discs and plates
  • Washers and rings
  • Rods and bars
  • Tubes and sleeves
  • Cylindrical components
  • Insulating spacers
  • Thermal management components
  • Stepped and tapered parts
  • Flanged components
  • Components with precision holes and grooves
  • Other application-specific geometries

Custom dimensions and tolerances can be evaluated according to component geometry, material grade, production volume, and manufacturing process.


Precision Processing of BeO Ceramic

For applications requiring more than standard ceramic shapes, Coraynic provides precision ceramic processing after sintering.

Available processes may include:

  • Precision grinding
  • Surface grinding
  • OD/ID grinding
  • CNC machining
  • Drilling
  • Hole processing
  • Slot and groove machining
  • Step and profile machining
  • Dimensional finishing

Small holes and complex geometries can be evaluated according to material properties, component dimensions, tolerances, and production requirements.


BeO Ceramic Metallization

For applications requiring electrical connection, brazing, soldering, or ceramic-to-metal joining, BeO ceramic can be supplied with customized metallization.

Available metallization options may include:

  • MoMn metallization
  • Tungsten metallization
  • Active brazing
  • Thin-film metallization
  • Thick-film metallization
  • Nickel plating
  • Gold plating

Metallization patterns can include full-surface metallization, selective areas, edge metallization, and other application-specific configurations.

For detailed information, see our Metallized BeO Ceramic product page.


BeO Ceramic-to-Metal Sealing

BeO ceramic can also be integrated with metallic components for hermetic and high-reliability assemblies.

Depending on the application, compatible metals may include:

  • Kovar
  • Oxygen-free copper
  • MoCu
  • Titanium alloys
  • Stainless steel
  • Other application-specific alloys

Joining methods may include brazing, active brazing, soldering, electron beam welding, and laser welding, depending on the component design and required performance.

Typical applications include hermetic packages, feedthroughs, RF components, vacuum components, and high-reliability electronic assemblies.


Applications

BeO ceramics are used in applications where thermal management and electrical insulation are required simultaneously.

RF & Microwave

  • RF power amplifier components
  • Microwave devices
  • High-frequency packages
  • Microwave communication modules
  • RF thermal management components

Power Electronics

  • High-power semiconductor packages
  • Power electronic substrates
  • Heat spreaders
  • Electrical insulating components
  • High-power electronic assemblies

Semiconductor & Microelectronics

  • Semiconductor packages
  • High-power device components
  • Electronic substrates
  • Insulating components
  • Thermal management parts

Vacuum Electronics

  • Microwave vacuum devices
  • Insulating components
  • Vacuum feedthrough assemblies
  • High-temperature electronic components

Aerospace & High-Reliability Electronics

BeO ceramic can be considered for aerospace and other high-reliability electronic applications requiring high thermal conductivity, electrical insulation, and dimensional stability.

Optoelectronics

  • Laser components
  • High-power laser assemblies
  • Optical communication components
  • Electronic-optical modules

Manufacturing & Engineering Capability

Coraynic combines BeO ceramic material expertise with precision component manufacturing, metallization, and ceramic-to-metal joining capabilities.

Our manufacturing workflow can include:

BeO Powder → Forming → Sintering → Precision Processing → Metallization → Plating → Brazing / Sealing → Inspection

This integrated capability allows customers to source not only basic BeO ceramic materials, but also application-specific engineered ceramic components.

For OEM projects, we can work from:

  • 2D engineering drawings
  • 3D CAD models
  • Technical specifications
  • Samples
  • Material requirements
  • Application requirements

Quality Control

Quality control can be performed according to product specifications and customer requirements, including:

  • Material purity
  • Density
  • Thermal conductivity
  • Dielectric properties
  • Dimensional accuracy
  • Surface condition
  • Hole and geometry dimensions
  • Metallization integrity, when applicable
  • Ceramic-to-metal joint quality, when applicable

Inspection documentation and material certificates can be provided according to the project requirements.


Custom BeO Ceramic Solutions

If your application requires a BeO ceramic component with specific thermal conductivity, purity, dimensions, tolerances, surface finish, geometry, metallization, or sealing requirements, Coraynic can evaluate the design and recommend a suitable manufacturing approach.

Please provide your:

  • Drawing or CAD file
  • BeO purity requirement
  • Dimensions and tolerances
  • Thermal conductivity requirement
  • Quantity
  • Metallization requirements, if applicable
  • Ceramic-to-metal joining requirements, if applicable

Our engineering team can review the requirements and provide a customized quotation and technical proposal.

Request a BeO Ceramic Quote →