Metallized Beryllium Oxide Ceramic for High-Power RF, Microwave Vacuum Devices, Radar T/R Modules, Semiconductor Packaging, and Defense Electronics
Beryllium Oxide (BeO) ceramic is the **material of choice** when extreme thermal management and electrical insulation are required. With **thermal conductivity of 310 W/m·K** – second only to diamond – and a **low dielectric constant of 6.9 @ 1MHz**, BeO significantly outperforms AlN, Al₂O₃, and Si₃N₄ in high-frequency, high-power applications.
Coraynic Technology offers **99.5% high-purity BeO ceramic with advanced MoMn (Molybdenum-Manganese) metallization**, providing a **robust, solderable, and brazable surface** that enables **hermetic sealing** and direct bonding to metals such as copper, kovar, stainless steel, and titanium.
The metallization process is performed at **optimized sintering temperatures below 1550°C**, preserving the intrinsic properties of the BeO substrate while delivering:
– **Excellent solderability** (Au/Sn, Ag/Cu eutectic compatible)
– **High tensile strength** of the nickel-plated layer
– **Multi-layer metal build-up capability**
– **Vacuum-tight hermeticity** (<5×10⁻¹² Pa·m³/s)
These metallized ceramics are **critical components** in:
– **Defense radar systems** (phase shifters, T/R modules, X-band and above)
– **Satellite communication** modules
– **High-power microwave vacuum devices** (traveling wave tubes, magnetrons, klystrons)
– **Semiconductor power packaging** (GaN, GaAs, SiC, IGBT)
– **Optoelectronic devices** (infrared detection, imaging)
– **Medical electronics** (gas lasers, defibrillators)
After metallization, the BeO ceramic retains its **superior thermal conductivity, low dielectric loss, and high insulation resistance**, while gaining the ability to be **welded, brazed, and hermetically sealed** with metal components – transforming the ceramic from a basic material into a **fully integrated electronic device package**.
## Key Features & Benefits
– **Ultra-High Thermal Conductivity:** 310 W/m·K @25°C – 12× higher than alumina, 1.7× higher than AlN.
– **Low Dielectric Constant & Loss:** 6.9 @ 1MHz, 6.8 @ 10GHz; dissipation factor ≤4×10⁻⁴ – ideal for X-band, Ku-band, Ka-band.
– **CTE Matched to Semiconductors:** 9.2 ×10⁻⁶/°C – compatible with silicon, GaAs, GaN, kovar, copper.
– **MoMn Metallization:** 15–38 µm MoMn layer + 2–10 µm nickel plating.
– **Optimized Sintering:** ≤1550°C – preserves substrate integrity, reduces thermal stress, enables multi-layer metal build-up.
– **Excellent Solderability:** Au/Sn, Ag/Cu, Pb/Sn compatible. No dewetting, high bond strength.
– **Hermetic Sealing Capable:** Vacuum-tight, suitable for brazing and welding in military/aerospace packages.
– **High Mechanical Strength:** Compressive strength >350 MPa, hardness >HRA86.
– **Customizable Patterns:** Full surface, selective areas, via holes, edge wraps, laser scribing.
– **Proven in Defense & Telecom:** Used in radar phase shifters, T/R components, electronic countermeasures, telemetry.
## Technical Specifications (99.5% BeO with MoMn Metallization)
| Property | Unit | Value |
|———-|——|——-|
| **Base Material** | | |
| Purity | % | 99.5% BeO |
| Composition (typical) | – | BeO: 99.5%, Al₂O₃: 0.18%, SiO₂: 0.13%, Others: 0.19% |
| Color | – | White |
| Density | g/cm³ | 3.05 |
| Thermal Conductivity (25°C) | W/m·K | 310 |
| Dielectric Constant (1MHz) | – | 6.9 ±0.2 |
| Dielectric Constant (10GHz) | – | 6.8 ±0.2 |
| Dissipation Factor (1MHz) | – | ≤4×10⁻⁴ |
| Dissipation Factor (10GHz) | – | ≤4×10⁻⁴ |
| CTE (25–500°C) | ×10⁻⁶/°C | 9.2 |
| Volume Resistivity (25°C) | Ω·cm | >10¹⁴ |
| Dielectric Breakdown Strength | kV/mm | ≥25 |
| Compressive Strength | MPa | >350 |
| Hardness | HRA | >86 |
| Flexural Strength | MPa | ≥200 |
| Flatness | mm | <0.035 |
| Surface Roughness (Ra) | μm | 0.05 – 0.8 (customizable) |
| Camber | ‰ | ≤2 |
| Air Tightness | Pa·m³/s | ≤5×10⁻¹² |
| Grain Size | μm | 10 – 20 |
| **Metallization Layer** | | |
| Metallization Material | – | MoMn (Molybdenum-Manganese) |
| MoMn Thickness | μm | 15 – 38 |
| Nickel Plating Thickness | μm | 2 – 10 |
| Optional Gold Flash | μm | 0.05 – 0.3 (upon request) |
| Sintering Temperature | °C | ≤1550 (optimized for BeO preservation) |
| Solderability | – | Excellent, Au/Sn, Ag/Cu, Pb/Sn |
| Tensile Strength (Ni layer) | MPa | >100 |
| Multi-layer Build-up | – | Supported by multiple sintering cycles |
## Standard & Custom Sizes
### Substrate (Rectangular / Square)
| Thickness (mm) | Length × Width (mm) |
|—————-|———————|
| 0.385 | 50.8 × 50.8 (2″×2″) |
| 0.5 | 76.2 × 76.2 (3″×3″) |
| 0.635 | 101.6 × 101.6 (4″×4″) |
| 1.0 | 114.3 × 114.3 (4.5″×4.5″) |
| 1.5 | Custom dimensions |
| 2.0+ | Consult engineering |
### Disc / Round Substrates
| Diameter (mm) | Thickness Range (mm) |
|—————|———————-|
| 20, 26, 30, 35, 50, 52, 60, 75, 100, 110 | 0.25 – 2.0 |
### Custom Shapes
| Component Type | Examples |
|—————-|———-|
| **Clamping Rods** | Traveling wave tube spiral supports, magnetron clamping bars |
| **Windows** | High-power microwave transmission windows |
| **Cylinders / Tubes** | Feedthrough insulators, vacuum envelopes |
| **Washers / Rings** | Hermetic sealing spacers |
| **Custom Profiles** | Stepped, tapered, flanged, threaded, notched |
### Metallization Pattern Options
| Pattern Type | Description |
|————–|————-|
| Full Surface | Entire top/bottom surface metallized |
| Selective Areas | Patterned metallization per customer CAD |
| Edge Wraps | Top-to-bottom metallization on edges |
| Via Holes | Metallized through-holes for vertical interconnection |
| Laser Scribing | Isolation grooves, alignment marks |
## Applications
### 1. Military & Aerospace Defense
– **Radar Phase Shifters & T/R Modules** – X-band, Ku-band, Ka-band
– **Electronic Countermeasures** – Jamming systems, telemetry
– **Missile Guidance** – High-reliability hermetic packages
– **High-Power Microwave Windows** – Traveling wave tube (TWT) output windows
– **TWT Spiral Support Rods** – Precision clamping with low dielectric loss
### 2. RF & Microwave Communication
– **Base Station Power Transistors** – GaN on BeO, SiC on BeO
– **Satellite Communication Modules** – LEO, GEO, ground stations
– **Point-to-Point Microwave Radios** – 5G backhaul
– **High-Frequency Filters & Duplexers**
### 3. Power Electronics
– **High-Power Semiconductor Device Packaging** – IGBT, MOSFET, thyristors
– **Heat Sinks for Laser Diodes** – High-brightness LEDs, VCSELs
– **Intelligent Power Modules (IPM)** – Industrial motor drives
### 4. Optoelectronics & Medical
– **Infrared Detection & Imaging** – Thermal camera substrates
– **Gas Laser Cavities** – DNA analysis, tissue imaging
– **Portable Defibrillator Components** – High-voltage insulation
### 5. Nuclear & Vacuum Electronics
– **Vacuum Tube Envelopes** – Collector insulators
– **Neutron Moderator Components** – Nuclear instrumentation
– **Feedthrough Insulators** – Hermetic electrical feedthroughs
## Engineering Capability
Coraynic Technology operates a **vertically integrated advanced ceramics engineering center** equipped with state-of-the-art manufacturing, metrology, and quality assurance systems. Our engineering team has **50+ professional ceramic and electronics engineers** with deep expertise in beryllium oxide processing, metallization, and hermetic packaging.
### ✅ Manufacturing Equipment
| Equipment | Function |
|———-|———-|
| **CNC Precision Grinding Machine** | High-tolerance surface grinding, contour profiling |
| **Powder Molding Press** | Isostatic and uniaxial pressing of BeO powder |
| **Cold Isostatic Press (CIP)** | High-density green body formation |
| **Centrifugal Spray Granulator** | Uniform granule size for consistent sintering |
| **High-Temperature Sintering Furnace** | 1750°C+ capability, atmosphere control (air, H₂, N₂) |
| **MoMn Metallization Furnace** | Controlled atmosphere, ≤1550°C optimized profile |
| **Nickel/Gold Plating Line** | Electrolytic and electroless plating, thickness control ±1 μm |
| **Laser Cutting & Drilling System** | Via holes, scribing, contour cutting ±0.01 mm |
| **Ultrasonic Machining** | Complex shapes, brittle material processing |
### ✅ Metrology & Quality Assurance
| Instrument | Application |
|———–|————-|
| **ICP Plasma Spectrometer** | Purity analysis, trace element detection |
| **Laser Particle Analyzer** | Powder particle size distribution |
| **Universal Tool Microscope** | Dimensional inspection, edge quality |
| **Precision Surface Grinder** | Surface finish control (Ra 0.05–0.8 μm) |
| **Surface Roughness Tester** | Ra, Rz verification |
| **Atomic Absorption Spectrophotometer** | Chemical composition analysis |
| **Helium Leak Detector** | Air tightness testing (<5×10⁻¹² Pa·m³/s) |
| **Thermal Conductivity Meter** | Laser flash method (25°C–1000°C) |
| **Dielectric Strength Tester** | HV breakdown verification |
| **Universal Testing Machine** | Flexural, compressive, tensile strength |
| **CMM (Coordinate Measuring Machine)** | 3D dimensional tolerance certification |
### ✅ Process Capabilities
| Process | Specification |
|———|—————|
| **BeO Powder Processing** | 99.5% purity, grain size 10–20 μm |
| **Forming** | Dry pressing, CIP, extrusion |
| **Sintering** | Pressureless sintering, 1700–1750°C |
| **Metallization** | MoMn screen printing / coating, 15–38 μm |
| **Plating** | Electroless Ni, electrolytic Ni, Au flash |
| **Multi-layer Build-up** | Up to 3 sintering cycles |
| **CNC Grinding** | Flatness <0.035 mm, camber ≤2‰ |
| **Laser Processing** | Via diameter ≥0.1 mm, tolerance ±0.01 mm |
| **Ultrasonic Machining** | Complex 2D/3D profiles |
| **Polishing** | Ra <0.1 μm optical finish |
### ✅ Engineering Support
Our engineering team provides **end-to-end technical support**:
– **Material Selection Assistance** – BeO vs. AlN vs. Al₂O₃ trade-off analysis
– **Metallization Pattern Design** – CAD import, DFM review
– **Brazing Compatibility Consultation** – Brazing filler metal selection, joint design
– **Thermal Simulation** – Junction temperature prediction, heat spreader optimization
– **Hermeticity Testing** – Fine leak / gross leak qualification
– **Reliability Testing** – Thermal cycling (-55°C to +150°C), HAST, PCT
> **”From raw BeO powder to finished metallized component – we control every step.”**
## Why Choose Coraynic Technology?
– **Vertically Integrated:** In-house BeO powder processing, pressing, sintering, grinding, metallization, plating, and inspection.
– **Defense & Aerospace Qualified:** Supplier to state-owned defense enterprises and high-technology research institutes of China Electronics Technology.
– **Proven Track Record:** 10+ years experience in beryllium oxide ceramics for military, nuclear, and telecom applications.
– **Process Control:** 100% QC with advanced analytics – ICP, laser particle analysis, helium leak detection.
– **Custom Engineering:** Our engineers work directly with your design team to optimize metallization patterns, tolerances, and brazing interfaces.
– **Compliance:** RoHS, CE, REACH, ITAR compliant. Full SDS and material traceability provided.
– **Global Shipping:** UN 1566 6.1/PG 2 certified safe packaging. Leak-proof, sealed containers.
> **Contact our metallization engineering team:**
> **Email:** sales@coraynic.com
> **Phone:** +86 187 61951906
> **Request a quote:** www.coraynic.com/contactus.html
> *Response within 4 hours · RFQ sample available · 98% on-time delivery*
## Safe Handling & Compliance (Mandatory)
Beryllium Oxide products are engineered for **professional/industrial use only**. Coraynic Technology provides a **comprehensive Safety Data Sheet (SDS)** with every shipment.
| Hazard | Precaution |
|——–|————|
| Inhalation of dust/fumes | Use with adequate ventilation / local exhaust. Wear appropriate PPE (N95 respirator, gloves, safety glasses). |
| Skin contact | Remove contaminated clothing. Rinse with plenty of running water. |
| Eye contact | Lift eyelids, rinse with water or saline. Seek medical attention. |
| Ingestion | Drink plenty of warm water, induce vomiting. Seek immediate medical attention. |
| Transport | UN 1566 6.1/PG 2. Do not mix with acids, oxidizers, food. Avoid exposure to rain, high temperature. |
**⚠️ Chronic exposure to beryllium dust can cause serious lung disease. Never machine, grind, or modify BeO ceramics without proper engineering controls and respiratory protection. Coraynic follows international beryllium safe handling protocols.**
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**© 2025 Coraynic Technology Limited – Your reliable advanced ceramic material partner.**
*All technical data are based on 99.5% BeO grade at room temperature. Custom specifications welcome. Safety Data Sheet (SDS) available upon request. Beryllium Oxide products are intended for professional industrial use only.*
