99.5% BeO Ceramic Substrate – High Thermal Conductivity, Low Dielectric Loss for RF/Microwave & Power Electronics

99.5% BeO Ceramic Substrate – High Thermal Conductivity, Low Dielectric Loss for RF/Microwave & Power Electronics

Beryllia (BeO) Substrates for High-Power Semiconductor Packaging, IGBT Modules, Microwave Circuits, and LED Heat Sinks

Product Description

99.5% BeO Ceramic Substrate

High Thermal Conductivity Beryllium Oxide Substrate for RF, Microwave & Power Electronics

Beryllium Oxide (BeO) ceramic substrates provide the highest thermal conductivity among insulating ceramics, second only to diamond. With thermal conductivity of 250–285 W/m·K, low dielectric constant (6.6–6.8), and extremely low dielectric loss, BeO is the ideal material for high-power and high-frequency electronic applications where efficient heat dissipation and signal stability are critical.

We supply 99.5% high-purity BeO ceramic substrates in standard and fully customized sizes with optional surface finishing and metallization. These substrates are widely used in RF power transistors, microwave devices, IGBT modules, LED heat sinks, and aerospace systems.
BeO’s coefficient of thermal expansion closely matches silicon and GaAs, ensuring excellent reliability during thermal cycling and soldering processes.

Key Features & Benefits

  • Ultra-High Thermal Conductivity: 250–285 W/m·K

  • Low Dielectric Constant & Loss: 6.6–6.8, tan δ ≤ 0.0004

  • Excellent Electrical Insulation: Volume resistivity >10¹⁴ Ω·cm

  • High Mechanical Strength: Flexural ≥200 MPa

  • CTE Matched to Semiconductors: Suitable for Si, GaAs, GaN

  • Thermal Shock Resistant

  • Custom Shapes & Sizes Available

  • Multiple Surface Finish Options

  • Compatible with Thick Film, Thin Film, DBC & MoMn Metallization

 

Property Unit Value
Purity % 99.5
Density g/cm³ ≥2.88
Color White
Thermal Conductivity (25°C) W/m·K 285
Thermal Conductivity (100°C) W/m·K 220
Dielectric Constant (1 MHz) 6.6 ±0.2
Dielectric Constant (10 GHz) 6.8 ±0.2
Dissipation Factor ≤4×10⁻⁴
CTE (25–500°C) ×10⁻⁶/°C 7.0–8.0
Dielectric Strength kV/mm ≥40
Flexural Strength MPa ≥200
Compressive Strength MPa >350
Young’s Modulus GPa 345
Surface Roughness (Ra) μm 0.05–0.8

Available Sizes

Square / Rectangular

  • Thickness: 0.254 – 1.5 mm

  • Standard sizes from 1″×1″ to 4.5″×4.5″

  • Custom dimensions available

Round / Disc

  • Diameters: 20–110 mm

  • Thickness range: 0.25 – 2.0 mm

Custom shapes: rings, windows, rods, stepped geometries
Surface finish: as-fired, lapped, polished
Metallization: MoMn, Ni/Au, thin film, thick film, DBC

Applications

RF & Microwave

  • RF power transistor packages

  • Microwave amplifiers and radar modules

Power Electronics

  • IGBT & IPM modules

  • Power converters and DBC substrates

LED & Optoelectronics

  • High-brightness LED heat sinks

  • Laser diode submounts

Aerospace & Defense

  • Radar systems

  • Missile and avionics components

Medical & Industrial

  • Gas lasers

  • Precision industrial equipment

Why Choose Us

  • ISO 9001 certified manufacturing

  • Advanced quality inspection systems

  • Custom engineering & fast prototyping

  • Reliable global shipping

  • Industrial & defense-grade quality standards

Contact: sales@coraynic.com
Phone: +86 187 61951906