Product Overview

Beryllium Oxide (BeO) ceramic heat sink substrates are designed for high-power electronic systems that require excellent heat dissipation and electrical insulation. Compared with traditional aluminum oxide substrates, BeO ceramics provide significantly higher thermal conductivity, allowing heat to be transferred away from sensitive components more efficiently.

These substrates are widely used in power semiconductor modules, microwave devices, and RF communication systems where thermal management is critical.

Key Features

• Ultra-high thermal conductivity
  • Excellent electrical insulation
  • Low dielectric loss
  • High temperature stability
  • Low thermal expansion

Technical Specifications

Material: 99.5% BeO
Thermal conductivity: 200–325 W/m·K
Density: 2.9 g/cm³
Flexural strength: 200 MPa
Max working temperature: 2000°C

Applications

Power electronics modules
RF amplifiers
high power LED modules
satellite communication systems