The ceramic quadruple-sided leadless housing (CQFN) uses a vertical signal transmission structure with sidewall hanging holes or internal hole filling to transmit control signals or RF signals from DC to 40 GHz.
control signals or RF signals. The commonly used lead pitch is 1.27mm, 0.65mm, 0.5mm, etc. The core area grounding method is classified as metalized grounding or metallic thermal grounding to meet the different thermal requirements of the chip.
The grounding method of the core area can be metallized grounding or metallic thermal grounding to meet the different heat dissipation requirements of the chip, and a variety of cap forms such as parallel seam welding and alloy fusion sealing can be selected. This type of shell has small in size, light-weight and
High-frequency performance and other characteristics