DPC ceramic substrate

specification

Number of layers: 2 layers

Board thickness: 1.0 +/-0.1mm plate used: 96% alumina minimum aperture: 2.0mm surface treatment: sunk gold

Insulation layer thermal conductivity: 30W outer copper thickness: 35um gold thickness: > = 3u

Process characteristics: through-hole, ceramic-based

application

Application areas: communication antennas, automotive power control modules, AC converters, light changing systems, ignitors, DC-AC converters, switching regulators, solid-state relays, rectifier bridges, high power LEDs, etc.