DPC ceramic substrate

DPC ceramic specification

Number of layers: 2 layers

Board thickness: 1.0 +/-0.1mm

ceramic substrate: 96% alumina minimum

aperture: 2.0mm

surface finish: sunk gold

Insulation layer thermal conductivity: 30W

outer copper thickness: 35um

gold thickness: > = 3u

Process characteristics: through-hole, ceramic-based

Application

Application: communication antennas, automotive power control modules, AC converters, light changing systems, ignitors, DC-AC converters, switching regulators, solid state relays, rectifier bridges, high power LEDs, etc.